On May 24, Toshiba Electronic Components and Storage Co., Ltd. (hereinafter referred to as Toshiba) issued an announcement on May 23, announcing the completion of its 300 mm wafer power semiconductor manufacturing plant and office building.

Toshiba said in a press release that it is currently installing equipment and aiming to start mass production in the second half of fiscal 2024. Once the first phase of the project is fully operational, Toshiba's power semiconductor (mainly MOSFETs and IGBTs) will have 2.5 times the production capacity of the investment plan in FY2021, while the construction and commencement of operations of the second phase will be decided based on market conditions.

The new manufacturing building follows Toshiba's Business Continuity Plan (BCP) and will make a significant contribution to Toshiba's Business Continuity Plan (BCP): it has a seismic isolation structure that absorbs seismic shocks and a redundant power supply.

Toshiba said that the new manufacturing plant, which has a seismic isolation structure and power supply that absorbs seismic impacts, will follow Toshiba's Business Continuity Plan (BCP) and will make a significant contribution to Toshiba's business continuity plan. Once the entire plant is in mass production, the facility will be able to meet 100% of its electricity requirements from renewable sources through renewable energy and energy from solar panels on the roof of the building.