BYD has not only achieved the world's first good results in new energy vehicles, but also is one of the few domestic car brands that can develop its own chips, but in 2022, BYD's semiconductor listing plan was suddenly suspended, but the founder Wang Chuanfu recently stated that the plan to seek listing remains unchanged.

At the performance meeting on March 29, Wang Chuanfu said that "BYD Semiconductor's listing plan remains unchanged, but there are some adjustments in the process."

He also mentioned that BYD's vehicle growth cannot maintain such a high growth rate every year, and as the growth rate returns to normal, I believe that the proportion of BYD's semiconductor business dependent on the group will be reduced at an appropriate time in the future, and it will have the conditions for listing at that time.

BYD Semiconductor, formerly known as Shenzhen BYD Microelectronics Co., Ltd., was renamed BYD Semiconductor Co., Ltd. in 2020, with BYD holding 72.3% of the shares, and has been seeking to go public after receiving an investment of 2.7 billion yuan in the previous two rounds of financing.

After the Shenzhen Stock Exchange accepted the IPO in June 2021, BYD Semiconductor suffered two IPO suspensions, and finally suddenly announced on November 15, 2022 that it would terminate the spin-off and listing of BYD Semiconductor and withdraw the listing application documents related to listing on the GEM.

As early as 2005, BYD Semiconductor began to develop its own automotive power module chips such as IGBT, and in 2018, BYD Semiconductor released the IGBT4.0 technology with benchmarking significance in the field of automotive specifications.

Through the refined plane grid design, the IGBT4.0 chip reduces the comprehensive loss by about 20% compared with the mainstream products in the market under the same working conditions, and the power consumption of the whole vehicle is significantly reduced.

In 2021, BYD Semiconductor's IGBT 5.0 technology based on high-density Trench FS has achieved mass production, IGBT5.0 (Trecnch FS IGBT) adopts a micro-trench structure and composite field abort technology to achieve ultra-low conduction losses and switching losses, and due to the extremely tuned composite field termination technology, soft shutdown is realized.

In the domestic market, BYD's share of power modules in the first three quarters of 2022 has reached 21.1%, approaching the 25.7% of the first place Infineon.